Huawei Mate30 Pro 5G disassembly： self-developed chips accounted for more than half, and American components further declined.

This article is transferred from "Xin Zhixun"

On September 19th this year, Huawei officially released the annual flagship Mate 30 and Mate 30 Pro in Munich, Germany, and also announced the 5G version of Mate 30 series equipped with Kirin 990 5G chip. However, it was not until November 1st, more than a month after the launch of the 4G version of Mate30 series, that the 5G version of Huawei Mate 30 series, which was priced at 4999 yuan, was finally put on sale, and the sales in Huawei’s official mall exceeded 700 million in seven minutes.

Recently, TechInsights, a foreign professional analysis organization, conducted an in-depth disassembly analysis of Mate30 Pro 5G version (version of 8GB RAM+256GB ROM), which not only analyzed the main components on the motherboard of Mate30 Pro 5G version, but also included the disassembly analysis of Kirin 990 5G processor.

Let’s take a look at it:

According to TechInsights’ analysis of the motherboard of Mate30 Pro 5G,

Look at the front of the motherboard first. As indicated in the above figure, the components from left to right are:

Haisi Hi6421 power management IC

Haisi Hi6422 power management IC

Nxp PN80T secure NFC module

STMicroelectronics (stmicroelectronics) BWL68 Wireless Charging Receiver IC

Halo Micro (Guangdong Xidi Microelectronics) HL1506 Battery Management IC

Look at the back of the motherboard first. As indicated in the above figure, the components from left to right are:

Halo Micro (Guangdong Xidi Microelectronics) HL1506 Battery Management IC

Haisi Hi6405 audio codec

STMP03 (unknown)

Silicon Mitus SM3010 power management IC (possible)

Cirrus Logic CS35L36A audio amplifier

Lianfa technology MT6303 envelope tracker IC

Haisi Hi656211 power management IC

Haisi Hi6H11 LNA/RF switch

Murata front-end module

Haisi Hi6D22 front-end module

HiSilicon Kirin 990 5G SoC and SK Hynix H9HKNNNFBMAU-DRNEH 8GB Mobile LPDDR4X SDRAM with PoP package.

Samsung KLUEG8UHDB-C2D1 256GB UFS storage

Texas Instruments TS5MP646 MIPI switch

Haisi Hi1103 Wi-Fi/BT/GNSS wireless integrated IC

Haisi Hi6H12 LNA/RF switch

Cirrus Logic CS35L36A audio amplifier

Haisi Hi6D03 MB/HB power amplifier module

After introducing the motherboard, let’s take a look at another sub-version:

As indicated in the above figure, from left to right are:

Haisi Hi6365 RF transceiver

Unknown 429 power amplifier (possible)

Haisi Hi6H12 LNA/RF switch

Qualcomm QDM2305 front-end module

Haisi Hi6H11 LNA/RF switch

Haisi Hi6H12 LNA/RF switch

Haisi Hi6D05 Power Amplifier Module

Murata front-end module

Unknown 429 power amplifier (possible)

Let’s take a look at the internal situation of Kirin 990 5G:

As mentioned before, Kirin 990 5G integrated Huawei’s Ba Long 5005G baseband chip into the SoC for the first time, which made it the world’s first commercial 5G SoC, and also supported the SA/NSA dual-mode and backwards compatibility 4G/3G/2G network. In contrast, at present, other commercial 5G mobile phones are basically implemented in the form of processor plug-in 5G baseband, which will further increase the cost and power consumption.

Kirin 990 5G adopts PoP package, and SK Hynix H9HKNNNFBMAU-DRNEH 8GB mobile LPDDR4X SDRAM is stacked on top of it, which is the same as what we saw in Huawei Mate 20 X(5G) before.

The chip size of Kirin 990 5G SoC is 10.68mm x 10.61mm = 113.31mm 2. In contrast, the chip size of Mate 20 X(5G) and Kirin 9804G AP+modems is 8.25mm x 9.16mm = 75.57mm2, while the chip size of Balong 5000, an independent 5G modem, is 9.82mm x 8.74mm = 85.83mm2. Kirin 980 4G AP/modem chip size+5G Balong modem chip size = 161.4mm2 The die size of Kirin 990 5G SoC is 113.31mm2, which is much smaller than the previous two-component solution, which may be benefited from TSMC’s latest 7nm FinFET EUV technology.

Comparison of chip sizes between Kirin 980 (left) and Kirin 990 5G (right)

Summary: From the main 36 components in Huawei Mate 30 Pro 5G version listed above, 18 of them are from Huawei HiSilicon’s self-developed chips, accounting for half of the total. Moreover, we can see that Huawei also introduced the battery management chip of Guangdong Xidi Microelectronics, a domestic chip manufacturer, and the envelope tracking chip of MediaTek in flagship machine for the first time. In addition, we can also see that the proportion of components from Japan, South Korea and Europe is also increasing. The front-end module of Murata in Japan, the silicon micro-power management IC in South Korea and the wireless charging chip of Legally Semiconductor in Europe all seem to enter Huawei’s flagship models for the first time.

Surprisingly, among the core components of Huawei Mate 30 Pro 5G version, there are still American devices, such as chips from Texas Instruments, and the RF front-end module of Qualcomm and the audio amplifier of Lingyunluo of the United States have appeared for the first time. At present, the United States has not lifted the ban on Huawei, and these American devices should have been stocked by Huawei before. However, compared with the previous internal main components of Mate 20 X 5G, the proportion of components from the United States is indeed further reduced. For example, instead of Qorvo and Skyworks front-end modules, there are more HiSilicon RF front-end devices and Murata front-end modules, and Meguiar’s DRAM has also been replaced by SKHynix’s.